.BondLib.Examples.ModelicaSpice.HighLevelWrapping .BondLib.Examples.ModelicaSpice.HighLevelWrappingThe Modelica-Spice models were built twice, once using bond graph technology all the way to the full-fledged transistor (high-level wrapping), and once more by wrapping lower-level components inside circuit diagrams, building up the complete transistor from these lower-level circuit diagram components (low-level wrapping).
Bond graph practitioners may prefer to stay within the bond graph methodology throughout, whereas electronic circuit designers may find the circuit diagram framework more familiar and easier to work with.
This package contains a second circuit diagram implementation of the laterally diffused NPN bipolar transistor, called Qnl2, built in high-level wrapping technology. The top-layer NPNwrapped inverter circuit is identical to the NPNlateral circuit of the InverterCircuit package, except that it calls upon Qnl2 instead of Qnl.
Experimentation:
Simulate separately the NPNlateral circuit of the InverterCircuit package and the NPNwrapped circuit of this package. Verify that the four output variables are identical.
| Name | Description |
|---|---|
 Qnl2 | Spice-style laterally diffused NPN bipolar transistor in high-level wrapping technology |
 NPNwrapped | Lateral NPN inverter circuit using high-level wrapping |