modelC1D
Heat conduction through wall
Extends from BondLib.Interfaces.TwoPort (Partial model invoking two bondgraphic connectors).
Information
The heat conduction model used here is the directed (why not) heat exchanger model of the bond graph library with an additional heat capacity built in at the output node. In this way, walls can be subdivided into layers, possibly consisting of different material, with heat conduction models cascaded without a need for attaching heat capacitors externally, except at the very first node.Heat capacitors were attached only at one side, because otherwise, higher index models result when such models get cascaded. Although Modelica is perfectly capable of reducing the perturbation index on its own, this would only have slowed down the compilation of the model unnecessarily.
Parameters
| Type | Name | Default | Description |
|---|---|---|---|
| Modelica.SIunits.ThermalResistance | theta | Thermal resistance | |
| Modelica.SIunits.HeatCapacity | gamma | Heat capacity |
Connectors
| Type | Name | Default | Description |
|---|---|---|---|
| BondLib.Interfaces.BondCon | BondCon1 (from TwoPort) | Left bond graph connector | |
| BondLib.Interfaces.BondCon | BondCon2 (from TwoPort) | Right bond graph connector |
Components
| Type | Name | Default | Description |
|---|---|---|---|
| Real | e1 (from TwoPort) | Bondgraphic primary effort | |
| Real | f1 (from TwoPort) | Bondgraphic primary flow | |
| Real | e2 (from TwoPort) | Bondgraphic secondary effort | |
| Real | f2 (from TwoPort) | Bondgraphic secondary flow | |
| BondLib.Bonds.fBond | B1 | ||
| BondLib.Bonds.fBond | B3 | ||
| BondLib.Bonds.eBond | B2 | ||
| BondLib.Bonds.eBond | B4 | ||
| BondLib.Bonds.eBond | B5 | ||
| BondLib.Junctions.J1p3 | J1p3_1 | ||
| BondLib.Junctions.J0p2 | J0p2_1 | ||
| BondLib.Junctions.J0p4 | J0p4_1 | ||
| BondLib.Thermal.RSth | RSth1 | ||
| BondLib.Thermal.Cth | Cth1 |