modelGj
Spice-style leakage conductance model
Extends from BondLib.Interfaces.PassiveOnePort (Partial model invoking one bondgraphic connector).
Information
The Spice-style leakage conductance model is a conductor element without temperature variation. The Level parameter is used to acknowledge the additional Area parameter of the Gummel-Poon transistor model. No heat port is needed here, as the model is used only as a mathematical construct to compute the currents of the non-linear current sources. The heat generation is accounted for in the non-linear sources.
Parameters: GminDC: Leakage conductance (default value = 1e-16 Mho) Area: Relative area occupied by resistor (default value = 1) Level: Transistor modeling level (Ebers-Moll = 1; Gummel-Poon = 2) (default value = 2)
Equations:
f = Area*GminDC*e
Parameters
| Type | Name | Default | Description |
|---|---|---|---|
| Modelica.SIunits.Conductance | GminDC | 1e-16 | Leakage conductance |
| Real | Area | 1 | Relative area occupied by device |
| Integer | Level | 2 | Transistor modeling level (Ebers-Moll = 1; Gummel-Poon = 2) |
Connectors
| Type | Name | Default | Description |
|---|---|---|---|
| BondLib.Interfaces.BondCon | BondCon1 (from PassiveOnePort) | Bond graph connector |
Components
| Type | Name | Default | Description |
|---|---|---|---|
| Real | e (from PassiveOnePort) | Bondgraphic effort | |
| Real | f (from PassiveOnePort) | Bondgraphic flow |