.BondLib.Spice.Utilities.mC3

Bondgraphic modulated capacitor element for Spice

Information

This model presents a generalization of the mC2 model presented in the semiconductor section, generalized for Spice-style transistor models. It computes also the external current, ix, which doesn't pass through the junction, but in parallel to it through the Cbx capacitor, which is realized as a current source to prevent an unnecessary higher index DAE problem. 

Potential variables:

 e:      Bondgraphic effort variable

 f:      Bondgraphic flow variable, normalized positive for flows into the model

 Cdiff:  Diffusion capacitance (modulating input signal)

 Cdepl:  Depletion capacitance (modulating input signal)

 ix:     External depletion capacitive current


Parameters:

 XCJC:   Fraction of depletion capacitance connected to internal base node (default value = 1)

 Level:  Transistor modeling level (Ebers-Moll = 1; Gummel-Poon = 2) (default value = 2)

Equations:

C = Cdiff + XCJ*Cdepl;
du = f/C;
ix = (1 - XCJ)*Cdepl*du;
der(e) = du;

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