.BondLib.Thermal.HE

Information

The bondgraphic symmetric linear heat exchange element is a directed TwoPort element. It inherits the effort and flow variables from the directed TwoPort. The thermal resistance is modeled as a parameter.

The heat exchange is driven by the temperature difference between the two sides. The generated entropy is divided evenly to the left and the right.

The heat exchange element has two causality strokes at the element.


Potential variables:

 e1:      Bondgraphic effort variable of inflow

 f1:      Bondgraphic flow variable of inflow, normalized positive for flows into the model

 e2:      Bondgraphic effort variable of outflow

 f2:      Bondgraphic flow variable of outflow, normalized positive for flows out of the model


Parameters:

 theta:   Thermal resistance (default value = 1 oK/W)

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