modelHE

Symmetric linear heat exchange element

Extends from Interfaces.TwoPort (Partial model invoking two bondgraphic connectors).

Information

The bondgraphic symmetric linear heat exchange element is a directed TwoPort element. It inherits the effort and flow variables from the directed TwoPort. The thermal resistance is modeled as a parameter.

The heat exchange is driven by the temperature difference between the two sides. The generated entropy is divided evenly to the left and the right.

The heat exchange element has two causality strokes at the element.


Potential variables:

 e1:      Bondgraphic effort variable of inflow

 f1:      Bondgraphic flow variable of inflow, normalized positive for flows into the model

 e2:      Bondgraphic effort variable of outflow

 f2:      Bondgraphic flow variable of outflow, normalized positive for flows out of the model


Parameters:

 theta:   Thermal resistance (default value = 1 oK/W)

Parameters

TypeNameDefaultDescription
Modelica.SIunits.ThermalResistancetheta1Thermal resistance

Connectors

TypeNameDefaultDescription
BondLib.Interfaces.BondConBondCon1 (from TwoPort)Left bond graph connector
BondLib.Interfaces.BondConBondCon2 (from TwoPort)Right bond graph connector

Components

TypeNameDefaultDescription
Reale1 (from TwoPort)Bondgraphic primary effort
Realf1 (from TwoPort)Bondgraphic primary flow
Reale2 (from TwoPort)Bondgraphic secondary effort
Realf2 (from TwoPort)Bondgraphic secondary flow
Junctions.J0p3J0p3_1
Junctions.J0p3J0p3_2
Junctions.J1p3J1p3_1
Bonds.fBondB3
Junctions.J0p3J0p3_3
Bonds.fBondB4
Bonds.fBondB5
RSthRSr
Bonds.eBondB2
Bonds.eBondB6
Bonds.fBondB1
RSthRSl
Bonds.eBondB7