.BondLib.Thermal.RSth

Information

The resistance, R, is proportional to the temperature at the inflow, T1. Since e1 represents the temperature difference, e1 = T1 - T2, and since e2 represents the temperature at the outflow, e2 = T2, the temperature at the inflow can be computed as: T1 = e1 + e2.

The linear conductive resistive source element is to be used in linear conduction of thermal systems. The primary side of the linear resistive source element is assumed to be in the thermal domain.

The resistive source element has free causality on the primary side, and fixed causality on the secondary side. The causality stroke is at the element on the secondary side (a source of entropy, rather than a source of temperature).

Potential variables:

 e1:      Bondgraphic effort variable of inflow

 f1:      Bondgraphic flow variable of inflow, normalized positive for flows into the model

 e2:      Bondgraphic effort variable of outflow

 f2:      Bondgraphic flow variable of outflow, normalized positive for flows out of the model

 R:       Bondgraphic thermal resistance


Parameters:

 theta:   Thermal resistance constant (default value = 1 oK/W)

Equations:

R = theta*(e1+e2)
e1 = R*f1
f2 = f1*(e1/e2)