.BondLib.Thermal.mRS

Information

The modulated resistive source element is to be used as a replacement for resistors in modeling the thermal behavior of non-thermal systems. The primary side of the modulated resistive source element is assumed to not be in the thermal domain.

The resistive source element has free causality on the primary side, and fixed causality on the secondary side. The causality stroke is at the element on the secondary side (a source of entropy, rather than a source of temperature).

Potential variables:

 e1:  Bondgraphic effort variable of inflow

 f1:  Bondgraphic flow variable of inflow, normalized positive for flows into the model

 e2:  Bondgraphic effort variable of outflow

 f2:  Bondgraphic flow variable of outflow, normalized positive for flows out of the model

 R:   Resistance value (modulation input signal)

Equations:

e1 = R*f1
f2 = f1*(e1/e2)